TLP headers in PCIe 6.0; AL/ML in functional verification; generative AI pilot; virtual twins for semi R&D; III-V tech.

The fourth quarter of 2024 saw five mega-rounds of over $100 million. One of the hottest areas continues to be AI hardware, with one company developing RISC-V AI processor IP bringing in nearly $700 ...

The U.S. Department of Energy will contribute $179 million for three new Microelectronics Science Research Centers, which will focus on research into solutions that bridge sensing, edge processing, AI ...

Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in ...

Deep UV microLED for maskless lithography; avalanching nanoparticles for optical computing; Probabilistic computing with stochastic spintronics.

Source Heterogeneous SoCs for AI: The PULP Platform Experience” was published by researchers at University of Bologna.