This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation ...

WaferWeight measurements may have resolution as low as 0.1mg. This allows precise tracking of changes in wafer mass between ...

Product security and reliability are major concerns in the semiconductor and PCB fabrication industries. Because of this, ...

ACM Research has introduced its new Panel Electrochemical Plating (Ultra ECP ap-p) tool designed for fan-out panel-level packaging (FOPLP). This new tool employs a horizontal plating approach ...

Its combination of high plating rates and excellent uniformity – typically ≤3% cross-wafer – is designed to ensure exceptional device feature uniformity.

MacDermid Alpha Electronics Solutions, a supplier of integrated materials and chemistries to the electronics industry, has unveiled MICROFAB TS-650 NXG, its next-generation tin-silver bump, pillar and ...

Substituting silver screen printing with copper plating for silicon wafer solar cell metallisation can significantly lower the material costs associated with cell production. However, given the recent ...

Wafer-level copper electroplating is an indispensable process in advanced packaging for manufacturing redistribution layers (RDL), micro-bumps, through silicon vias (TSV), etc., where coplanarity is a ...