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TSMC's liquid cooling; copper supply risks; EU's new GenAI rules; SIA's state of the industry report; GF acquires MIPS; LPDDR6 standard; memory market reports; GPU threat model; NPU technology to ...

This paper presents a temperature-dependent SPICE model of a novel Schottky-type gate GaN-on-AlN/SiC HEMT featuring immunity to back-gating effects. The modeling approach is based on the analytic ...