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Organic thermoelectric devices (OTEs) convert waste heat into useful electric power, but they are not yet efficient enough ...
Two-dimensional (2D) materials are among the most promising candidates for beyond-silicon electronic, optoelectronic, and quantum computing applications. Recently, their recognized importance sparked ...
Phase change materials (PCMs) are an attractive alternative to thermal greases/pads. While their thermal conductivity is not as good as greases, they are more manufacturable. This paper reports on ...
High-temperature polymers are attractive for applications in extreme temperatures, where they maintain their mechanical flexibility and electrical insulating properties. However, their heat ...
The report "Technical Textiles Market by Material (Natural Fiber, Synthetic Polymer, Metal, Mineral, Regenerated Fiber), ...
There are lots of reasons your hearing your house creak at night; other than a haunting by your local ghost, there's probably a more mundane reason.
Since the first Fan-out Wafer Level Packaging (FOWLP) was introduced in 2001 by Infineon, lots of technical advancements and studies related to this technology have been reported, but thermal studies ...
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