Google's upcoming Pixel 11 series (2026) is reportedly set to feature a Tensor G6 chip built on TSMC's advanced 2nm process.

Use precise geolocation data and actively scan device characteristics for identification. This is done to store and access ...

Intel has published a paper about its 18A (1.8nm-class) fabrication process at the VLSI 2025 symposium, consolidating all its ...

A deep dive into AMD’s Instinct MI350 GPU—featuring CDNA 4, 288GB HBM3E, and 3D chiplets—designed to take on NVIDIA in the AI ...

TSMC yields of next-gen 2nm have reached over 60% hitting mass production levels, making it harder and harder for Samsung ...

The global race to lead the market for next-generation 2-nanometer semiconductors is set to intensify in the second half of ...

Detailed price information for Taiwan Semiconductor ADR (TSM-N) from The Globe and Mail including charting and trades.

Explore next-gen transistor, from InGaOx GAA structures to Intel’s RibbonFET, unlocking higher density, efficiency, and performance.

TSMC could skip High-NA EUV for its next-gen A14 process for cost-efficiency over performance Samsung delays bleeding-edge 1.4nm node, puts its semiconductor eggs into its 2nm process ...

Apple chipmaker TSMC says that it will make chips with a sub-2nm process size for the first time ever in 2028, and that the development of 1.4nm chips will allow for greater AI capabilities.. The ...

TSMC has confirmed the existence of a 1.4-nanometer process, that will be used to make future Apple Silicon chips starting in 2028.

Because the transistors can be packed more densely as a result of the slag removal, the packing density increases by seven to ten percent. These improvements come with TSMC's A16 process.