Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

These are the most-read DIGITIMES Asia stories in the week of January 13 – January 17.

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

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CoWoS stands for chip wafer on a substrate. The CoWos-S is designed to meet the rigorous requirements of artificial intelligence chips. TSMC produces these for Nvidia and AMD (AMD). However ...

The revised road ... on CoWoS-S technology. Although other vendors have had stock price corrections, Nvidia sees the drop in CoWoS-S capacity as a purposeful change rather than a reaction to ...

The revised road plan presents ... sees the drop in CoWoS-S capacity as a purposeful change rather than a reaction to diminishing demand, the study said. The earnings call by TSMC on January ...

The ongoing viability of Moore's law is up for debate. But it seems Taiwanese megfab TSMC is determined to crank out new silicon regardless. The latest reports claim TSMC's next-gen 2nm chip node ...

TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging from Nvidia. According to sources at semiconductor ...

In a 2013 ITC paper [2], TSMC engineers described their test approach to assure “pretty good die” that worked within these constraints. First, they noted that power/ground signals are either a single ...