The foldable will reportedly feature a slightly larger 6.4-inch cover display (up from 6.3 inches on the Pixel 9 Pro Fold) ...

The Dimensity 8350 is a powerful mid-range chipset built on TSMC’s 4nm advanced process. It features an octa-core CPU that ...

Assuming this is the Nova Lake chipset, this likely confirms the hybrid nature of the tech, using a mix of both the N2 node ...

Technology stock valuations are hovering near all-time highs, but some value plays are hiding in the background.

Arizona will get its third chip plant from TSMC in 2027, and it doesn't hurt that that plant will make cutting-edge 2nm SoCs.

TSMC has become a critical supplier in the artificial intelligence supply chain, with growing momentum behind its advanced ...

Detailed price information for Taiwan Semiconductor ADR (TSM-N) from The Globe and Mail including charting and trades.

Qualcomm is working on a new Snapdragon wearable chip, which has been codenamed Aspen, and could have a model number SW6100.

Running on Funtouch OS, the vivo X200 FE introduces AI-powered features like AI Screen Translation, AI Captions, Smart Call ...

Google Pixel 10 series launch is widely expected in August and now the new details have leaked which suggests the possible ...

Google’s upcoming generation of A-Series earbuds is set to see a substantial price hike this year. The purported Pixel Buds ...

Qualcomm is reportedly developing a new smartwatch processor codenamed “Aspen” with the model number SW6100, expected to be ...