Product security and reliability are major concerns in the semiconductor and PCB fabrication industries. Because of this, ...

This study investigates failures in solder joints of Ball Grid Array (BGA) components using destructive techniques such as cross-section, dye and pry, and chemical etching with metallographic reagents ...

With the fast growth in semiconductor industry, packaging solutions of processor units and application specific integrated circuit (ASIC) devices to meet the needs of advanced Silicon (Si) nodes, ...

A ball grid array-module (BGA-module) incorporating a low-cost shaped dielectric lens is proposed for wireless communications in the 60-GHz WiGig band between a smart eyewear, where it is integrated ...