Aibuild, a leading innovator in advanced manufacturing software, introduced the BETA release of its new Finite Element ...

29% of thermal engineers are having to compromise the accuracy of their simulations due to hardware limitations, according to The State of Thermal, a survey of over 170 thermal engineers conducted by ...

(C) Simulation result chart with various underfill thermal conductivities. Case study 2: Large body package The second case study in this presentation is a coupled structural-thermal simulation of a ...

Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...

Thermal management factors in to the design of all electronic devices. When it comes to the thermal management of devices, engineering objectives primarily involve efficiency, safety, reliability, ...

Rafkin, S., Sta. Maria, M. & Michaels, T. Simulation of the atmospheric thermal circulation of a martian volcano using a mesoscale numerical model. Nature 419, 697–699 (2002 ...

Multi-scale simulation of thermal processes and microstructure evolution in wire arc additive manufacturing of 921A steel. Tsinghua University Press. DOI 10.26599/MAS.2025.9580003.

The Cadence Celsius Thermal Solver integrated within the Cadence IC, package, and PCB implementation platforms provides early-stage system analysis of thermal and stress fields. This paper ...

JEP181 from JEDEC is a neutral file XML-based standard for thermal models. The chosen file format is ECXML, for ‘electronics cooling extensible mark-up language’. “A de facto standard for a number of ...

Cadence Design Systems expanded its presence in the system analysis and design market with the introduction of the Cadence Celsius Thermal Solver, the industry’s first complete electrical-thermal ...