With AI being the biggest change in IT infrastructure since the Dot Com boom, it was no surprise that at the annual Cisco ...

Infineon has announced that its scalable GaN manufacturing on 300mm wafers is on track, with first samples available for ...

Intel is undergoing a major transformation, shifting from a CPU-centric model to a multi-platform foundry and AI silicon ...

Researchers from MIT, Georgia Tech, and Air Force Research Laboratory propose a bonding process to integrate gallium nitride ...

TSMC is expected to further solidify its leadership position with the ramp-up of 2nm technology, and its continued ...

Researchers create a photonic engine that can manipulate microwave and optical signals and convert the signals between the two domains ...

One major challenge still remains however - the age-old issue of heat. Wafer-scale chips can consume up to 10,000 watts of ...

Fraunhofer ISIT’s Power Electronics division (which develops prototypes for power electronic and sensor systems) will use ...

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new ...

It’s all about understanding who’s winning and why in the cpu market share 2024. Arm is really pushing to get a lot more of ...

Beyond the immediate question of "why do this at all," the T1 invites a question that's perhaps easier to interrogate: How can any modern smartphone claim to be made in the US?