Synova's Laser MicroJet Ò (LMJ) technology achieves outstanding results in SiC wafer edge beveling and profiling and is set to revolutionize the semiconductor industry. DUILLIER, Switzerland ...

Wafer scrap rates have reached up to 5 to 10 percent, a rate that is hard to bear for manufacturers when the price for a wafer is NT$300,000, he said. The institute uses a nanosecond pulsed laser ...

Traditionally, slicing SiC ingots into wafers involves diamond- or slurry-based wire sawing processes, resulting in significant kerf-loss of valuable material and increased wafer costs. On the other ...

Coherent will exhibit at Laser World of Photonics, in Munich, Germany, June 27-30, stand B3.321; Laser Korea, in Seoul, July 5-7, stand 4101; and Laser World of Photonics China, in Shanghai, stand ...

Taiwan's National Applied Research Laboratories and semiconductor equipment manufacturer Deuvtek have developed infrared nanosecond laser technology for SiC wafer grinding that cuts processing ...