Since the first Fan-out Wafer Level Packaging (FOWLP) was introduced in 2001 by Infineon, lots of technical advancements and studies related to this technology have been reported, but thermal studies ...

Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising solution ...

Leaning into trends such as sustainable secondary packaging and digital advancements can help beverage brands appeal to consumers.