The multi-chip LED modules are housed in a 5.23 x 13.7-mm case footprint, and 2.5-mm overall package height. The modular design allows the SEPM devices to be easily assembled into string arrays by ...

High package integration is one of the driving forces for high performance and small form factor packages. With increasing of multi-functional I/O density, the importance of thermal management is also ...

Multi-die packages are flavour of the month among the high-power LED manufacturers. Certainly for both manufacturers and designers chasing the title of “highest lumen output” device, this approach ...

Chip scale package LED market in the United Kingdom to reach US$ 176.5 million by 2033. The chip scale LED market is projected to be dominated by the United States with a market share of 80 to 92% ...

AMD has dedicated “significant resources” to the multi-chip package flash/SRAM series, said Kevin Plouse, vice president of technical marketing and business development for the company's Memory Group.

Multi-die packages are currently the 'flavour of the month' amongst the high power led manufacturers.

TSLC Corporation, a vertically integrated LED system manufacturer, introduced the world’s first 0.49mm fine-pitch direct-lit display using 36 pixels-i ...

Some companies have expressed great interest in iCometrue's Logic Drive and Field Programmable Multi-Chip Package (FPMCP) and approached iCometrue for further discussion.

Intel Inside The Package Mark Bohr opens up on the company's push into multi-chip solutions, and upcoming issues at 7nm and 5nm.

The mini-LED-driven “Neo QLED” TVs Samsung showed at CES 2023 were stunning to behold, and they proved the company capable of once again pushing the limits of that specific display tech.

San Francisco: As chip packaging gets more advanced, Intel has said it aspires to put a trillion transistors in a package by 2030 with his next-generation chip packaging technology. Intel has led ...