South Korean foundry SK Key Foundry and semiconductor packaging and testing specialist LB Semicon have jointly developed ...

Nexperia has announced the expansion of its bipolar junction transistor (BJTs) portfolio by introducing 12 new MJD-style BJTs in clip-bonded FlatPower (CFP15B) packaging.

An overview of the MRDIMM technology as a solution to memory bandwidth and capacity challenges.

Employing more stress testing at the wafer level improves quality while reducing burn-in time and cost. So why isn’t it ...

When Kaynes Semicon got greenlit by the India Semiconductor Mission in April 2024, most assumed the usual two-year delay ...

With the development trend of high power, high integration, and miniaturization of power electronics, the junction temperature has increased up to 250°C. Moreover, an integrated power module is ...

Advances in MMIC and RFIC technologies are driving 5G/6G and satellite communications with multi-band support, digital beamforming, and emerging sub-THz frequencies, while addressing key challenges in ...

Multi-Chip Modules enable combining different integrated circuits with passive components leading to advantages in size, performance and cost. This paper presents the design of a testchip which was ...