Employing more stress testing at the wafer level improves quality while reducing burn-in time and cost. So why isn’t it ...

New chip merges quantum light factories with on-chip control, enabling real-time stabilization of photon generation across 12 sources.

Professor Prem Kumar and a multi-institution research team built a first-of-its-kind silicon chip combining a photonic ...

When Kaynes Semicon got greenlit by the India Semiconductor Mission in April 2024, most assumed the usual two-year delay ...

Advances in MMIC and RFIC technologies are driving 5G/6G and satellite communications with multi-band support, digital beamforming, and emerging sub-THz frequencies, while addressing key challenges in ...

Automated test equipment market is pivoting from speed-centric instruments toward cloud-anchored, AI-driven, mixed-signal platforms that handle 6G, E ...

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Sercomm's TPM530M integrates Nordic’s cellular nRF9120 SoC and PMIC in a compact package, ensuring robust cellular IoT wireless connectivity for space-constrained applications Sercomm Corporation, a ...

The need for more input/output (I/O) connections was a big driver in package evolution. Think about it: a chip with a million ...

A key technical advancement enabling this development is the adoption of Wafer-Level Multi-Chip Module (WMCM) packaging for the A20 chip. The packaging method integrates different chip components, ...

$3B in R&D split among chip packaging, silicon photonics, and gallium nitride initiatives Packaging R&D supports advanced multi-chip modules; photonics targets quantum processor interconnects ...

Apple is planning to overhaul its chip design for the 2026 iPhones, marking the first time it uses advanced multi-chip packaging.