With chiplets gaining traction, chip designers face a critical question: When should you step away from a monolithic ASIC?

A research team at UNIST has developed a new deposition technology that enables the uniform mixing of different metals within a single atomic layer. This advancement holds significant promise for ...

Researchers at the Jülich Research Center and the Leibniz Institute for Innovative Microelectronics (IHP) have developed a ...

Researchers have developed a breakthrough semiconductor alloy that paves the way for advanced quantum, photonic, and ...

A new approach called monolithic synchronous integration enables the direct fabrication of lead-based optoelectronic devices on silicon circuits, promising simpler, cost-effective production of ...

Professor Prem Kumar and a multi-institution research team built a first-of-its-kind silicon chip combining a photonic ...

In a milestone for scalable quantum technologies, scientists from Boston University, UC Berkeley, and Northwestern University ...

Advanced packaging is becoming a key differentiator for the high end of the mobile phone market, enabling higher performance, ...

Kyocera will showcase its portfolio of semiconductor, fineceramic and automotive components at the exhibition and conference ...

Monolithic 3-D (M3D) IC is one of the potential technologies to break through the challenges of continued circuit power and performance scaling. In this paper, for the first time, we demonstrate the ...

In today’s SoC design approach, a monolithic IC is typically developed by licensing soft intellectual property (IP) functional blocks from multiple trusted third-party vendors. The team will also ...