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The Bakersfield Californian21d
Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry - bakersfield.com
Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry Business Wire Jun 16, 2025 ...
Design-Reuse1mon
Advanced IC Packaging: The Roadmap to 3D IC Semiconductor Scaling
www.eetimes.com, May. 20, 2025 – As the semiconductor industry approaches a projected market value of $1 trillion by 2030, the transition from traditional monolithic architectures to modular ...
Dataquest2mon
Siemens and Intel Foundry collaborate for ICs and advanced packaging solutions for 2D- and 3D-IC
Siemens Digital Industries Software announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional ...
Morningstar2mon
Ansys Thermal and Multiphysics Solutions Certified for Intel 18A Process and 3D-IC Designs - Morningstar
HFSS-IC Pro is certified for modeling on-chip electromagnetic integrity in radio frequency chips, WiFi, 5G/6G, and other telecommunication applications made with the Intel 18A process node.
Morningstar2mon
Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies - Morningstar
Cadence is expanding its design IP portfolio to meet the demands of the AI training market, delivering TSMC 9000-certified IP for 3D-IC design, including HBM3E 9.6G in N5/N4P and pre-silicon HBM3E ...
EDN5mon
Best of West Finalist, MonolithIC 3D, Inc., Announces Multiple 3D IC Technologies at SemiconWest - EDN
“We are delighted that the MonolithIC 3D, Inc. technology has been chosen by the semiconductor community as a Finalist for the Best of West Award at the upcoming SemiconWest 2011 industry show,” ...
TechSpot6mon
DRAM manufacturers explore new designs to overcome 3D stacking hurdles - TechSpot
The development of a monolithic 3D DRAM chip could provide an immediate boost if employed in the HBM architecture, Daryl Seitzer, principal product manager for embedded memories at Synopsys, told ...
Science Daily6mon
Engineers grow 'high-rise' 3D chips - ScienceDaily
Growth-based monolithic 3D integration of single-crystal 2D semiconductors. Nature, 2024; 636 (8043): 615 DOI: 10.1038/s41586-024-08236-9 ...
Nasdaq9mon
3D Systems Receives FDA Clearance for First-to-Market Multi-material, Monolithic Jetted Denture Solution - Nasdaq
As the first dental lab to have access to 3D Systems’ new multi-material, monolithic jetted denture workflow, we are looking forward to implementing a significantly better denture solution for ...
Business Insider9mon
3D Systems Receives FDA Clearance for First-to-Market Multi-material, Monolithic Jetted Denture Solution
3D Systems Receives FDA Clearance for First-to-Market Multi-material, Monolithic Jetted Denture Solution PRESS RELEASE GlobeNewswire Sep. 17, 2024, 08:30 AM ...
Electronic Design10mon
The vital role of accurate thermal analysis throughout the 3D IC design flow
By embracing robust thermal analysis methodologies and tools, designers can unlock the full potential of 3D IC technology, delivering innovative, high-performance devices that meet the demands of ...