Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation ...

Researchers have developed a breakthrough semiconductor alloy that paves the way for advanced quantum, photonic, and ...

Hybrid bonding is a crucial technology in 3D IC integration, enabling the combination of different functional chips through vertical interconnections. However, in hybrid bonding, the issue of copper ...

We have developed a hybrid bonding process that uses low-temperature curable polyimide to bond silicon chips with minimal damage. We designed a low elasticity photosensitive polyimide and a low-CTE ...

Generative-AI fever reshapes the artificial Intelligence (AI) in semiconductor market: design, packaging and foundry lines ...

In this article, unique intermolecular resonance-assisted hydrogen bonding (RAHB) is found to be activated by high temperature, which constructs an abnormal thermal-enhanced hydrogen bond-related π–π ...

BlueNord has successfully placed a new USD 300 million subordinated callable hybrid bond issue with maturity in 2085. The hybrid bond will have the first call at 100% of nominal value and coupon step ...

A new technical paper titled “Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, TEL, SK hynix, and University of ...

Canon Machinery, a subsidiary of Japan's Canon Inc., is intensifying its development of hybrid bonding technology as it seeks to expand beyond its conventional die-bonding equipment. The company ...