LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding ...

A new technical paper titled “Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review” was published by researchers at Chungbuk National University.

Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation ...

A Rutgers-led team of scientists has developed an eco-friendly, very stable, ultra-bright material and used it to generate deep-blue light (emission at ~450 nm) in a light-emitting diode (LED), an ...

A new technical paper titled “Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, TEL, SK hynix, and University of ...

BlueNord has successfully placed a new USD 300 million subordinated callable hybrid bond issue with maturity in 2085. The hybrid bond will have the first call at 100% of nominal value and coupon ...

Researchers have developed a breakthrough semiconductor alloy that paves the way for advanced quantum, photonic, and ...

Chem-Trend’s 2775W represents a solution for composites manufacturers who want high performance without the operational ...

CHARLESTON, W.Va. — The state Public Service Commission has rejected a request by Appalachian Power Company to cancel a hearing set for next week’s on the utility’s proposal to securitize $2 ...

A growing body of evidence shows that hybrid or remote work arrangements lead to lower overall performance. Many firms, however, don’t have the option to bring employees back on-site, for a ...

BlueNord ASA has successfully completed a USD 300 million subordinated hybrid bond issue and received approval from its lenders for this transaction and the buy-back of its subordinated ...