LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding ...

A new technical paper titled “Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review” was published by researchers at Chungbuk National University.

Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation ...

A Rutgers-led team of scientists has developed an eco-friendly, very stable, ultra-bright material and used it to generate deep-blue light (emission at ~450 nm) in a light-emitting diode (LED), an ...

Researchers have developed a breakthrough semiconductor alloy that paves the way for advanced quantum, photonic, and ...