Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.

LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth memory ...

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...

The launch of a new hybrid bonding system with 50nm accuracy is planned for the second half of 2025, targeting next-generation logic below 2nm design geometries.

A former SK Hynix employee has been charged with stealing wafer bonding and image sensor technologies to secure a job at Huawei’s HiSilicon, raising alarm over tech IP leaks to China.

BE Semiconductor Industries (Besi) , a supplier of advanced packaging tools for chipmakers, said on Wednesday its order bookings grew in the first quarter as Asian subcontractors ordered more AI ...

Hybrid bonding—a significant advancement in chip packaging technology—is becoming vital in heterogeneous integration, which enables semiconductor companies to merge multiple chiplets with diverse ...

BE Semiconductor Industries (Besi) expects a rise in demand for its hybrid bonding systems in 2025 following shipment delays in the fourth quarter, the chipmaking parts supplier said on Thursday ...

Hybrid bonding allows chips from different technologies and nodes to be closely interconnected, thereby improving power performance and lowering the size and cost of the most advanced chips.

Adeia continues to see growing interest in its hybrid bonding technology across the semiconductor industry and will be presenting at the following upcoming conferences: ...

BE Semiconductor's Q4 2024 earnings highlight growth in hybrid bonding and AI-driven computing markets.

(Reuters) -BE Semiconductor Industries (Besi) expects a rise in demand for its hybrid bonding systems in 2025 following shipment delays in the fourth quarter, the chipmaking parts supplier said on ...