SANTA CLARA, Calif. — Intel Corp. has scrapped its production plans to use 193-nm, argon-fluoride (ArF) lithography tools from Silicon Valley Group Inc. because of delays in tool shipments. The ...

Intel has all the LEGO blocks necessary and now it just needs to pull engineering talent away from AMD and Intel. Dave James . Published: Feb 1, 2019. Intel . Raja ...

Intel details its 3D Foveros packaging technology: LEGO-style chiplet CPU design for next-gen Meteor Lake, Arrow Lake, Lunar Lake CPUs of the future. News. All News AI Business, ...