Chipmakers generally don’t expect the much-delayed extreme ultraviolet (EUV) lithography in time for 10 nm chips, but many still hold out hopes it could be ready for a 7 nm generation. Mark Bohr did ...

Intel 7, Intel 4, and ... from microns to nanometers to angstroms—an angstrom is 0.1 nm. While Intel isn ... For one, the process will probably require more power than traditional lithography.

The 7-nm process technology will mark Intel’s first use of extreme ultraviolet (EUV) lithography. Murthy Renduchintala, Intel’s chief engineering officer and president of the company’s Technology, ...

A new technical paper (preprint) titled “Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous ...

Austin, Texas – Intel Corp. said it used its 65-nanometer process to make fully functional 4-Mbit test SRAMs, in essence launching the next go-round in the process technology-scaling competition among ...

Intel’s Intel 7 process, which powered the 12th and 14th Gen Core processors, was actually based on 10 nm Enhanced SuperFin lithography, despite being marketed as a 7 nm process. The shift to ...

Both chips are based on the same 10 nm Intel 7 lithography and utilize the LGA 1700 socket. However, with the newer variant, Intel has bumped up the core count.

After that, there’s Intel 3 (formerly 5nm), which is seen as an evolution of Intel 4, and it's the company’s second generation of extreme ultraviolet lithography (EUV) CPUs.

Intel will "describe a logic technology that incorporates second-generation high-k + metal gate technology, 193 nm immersion lithography for critical patterning layers and enhanced transistor ...

Using the Intel 14A process, the chipmaker said, it will be able to print features on silicon chips that are up to 1.7 times smaller than those made by existing EUV machines.