Co-developed with MediaTek, the rumored new APU would combine Arm-based processing with the power of Nvidia's Blackwell ...

Claims 130 W/m·K conductivity miracle A mysterious outfit calling itself Coracer has chucked a new graphene thermal pad into ...

Infineon announces collaboration with Typhoon HIL, a provider of Hardware-in-the-Loop (HIL) simulation solutions.

The chip features an H.264 video decoder and a 3D GPU capable of supporting 1080p displays via interfaces including MIPI DSI, LVDS, and RGB. Dual Gigabit Ethernet ports are integrated with ...

With our integrated custom IC design environment ... functionality of a schematic,'' said Bruce Gieseke, senior fellow, circuit design group of Advanced Micro Devices California Microprocessors ...

today announced that Shenzhen Integrated Circuit Design Industrial Center has licensed its low-power MIPS32® M4K® and MIPS32® 4Kc(TM) processor cores for next generation IC designs. The agreement ...

American technology is like a high-performance sports car. If you can’t train future engineers and technicians to understand, ...

Taiwan’s semiconductor prowess serves, in different ways, to provide a ‘silicon shield’, protecting the country from the threat of China.

Renowned physicist and Silicon Quantum Computing founder Professor Michelle Simmons has joined the Tech Council of Australia ...

SEGGER’s line of J-Link debug probes can now be used to both download a program into and debug Allegro MicroSystems MCUs.

GlobalFoundries’ new $3 billion investment will go towards upgrading its manufacturing facilities in New York and Vermont.

Thermal resistance from junction to case (θJC) is a metric of how easily heat flows from the die junction to the exposed pad (note that while FET devices have channels rather than junctions, the term ...