BE Semiconductor Industries is a provider of advanced semiconductor assembly equipment. Click here to find out why I rate ...

Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, ...

The launch of a new hybrid bonding system with 50nm accuracy is planned for the second half of 2025, targeting next-generation logic below 2nm design geometries. Financial Results.

Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.

Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image Sensor (CIS), NAND, DRAM, High Bandwidth Memory (HBM)).

BE Semiconductor Industries (Besi) raised its long-term financial targets ahead of its investor day on Thursday and said it expects to see the benefits of customers adopting its advanced chip stacking ...

Hybrid bonding machines are expected to be in great demand for the next 10 to 15 years for the manufacturing of advanced chips, and we estimate Besi is ahead of its closest competitors.

In hybrid bonding, various steps must be reliably performed to ensure quality. The process starts with manufacturing the wafers or dies in a semiconductor fab before the chips are bonded together. The ...

Degroof Petercam analysts said the upturn, which they expect to materialise in late 2025 or early 2026, should be stronger for Besi given its lead in hybrid bonding technology. ($1 = 0.8787 euros) ...

BANGALORE, India, April 11, 2025 /PRNewswire/ -- Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image ...

BANGALORE, India, April 11, 2025 /PRNewswire/ -- Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image ...