Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new ...

In this study, the recent advances and trends of Cu-Cu hybrid bonding (HB) will be investigated. Emphasis is placed on the design, materials, process, fabrications, reliability, challenges ...

LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth memory ...

A new technical paper titled “Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive ...

Researchers have developed a breakthrough semiconductor alloy that paves the way for advanced quantum, photonic, and ...

LG shares experienced gains in Seoul following reports that the company is developing advanced tools for manufacturing memory chips used with AI processors from Nvidia and other firms. According to ...

HONG KONG] LG Electronics shares advanced in Seoul after a local media report that the company is developing cutting-edge ...

Hybrid copper bonding (HCB) technology has been introduced and evaluated to overcome a fine pitch limit and degradation in thermal properties in 3D semiconductor package structure. In this study, we ...

To ensure stable electrical transmission in Cu/Cu interconnects, a relatively high bonding temperature is generally required, which poses particular challenges for low-temperature Cu/SiO 2 hybrid ...

Intermolecular interactions play a fundamental role in the properties of materials, including solvents. Yet, the complex interplay between these interactions, specifically hydrophobic interactions and ...