HANMI Semiconductor plans to combine TES's plasma, thin film deposition, and cleaning technologies with bonding technology for high-bandwidth memory (HBM). It is anticipated that global HBM ...

Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth ...

Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new ...

In this study, the recent advances and trends of Cu-Cu hybrid bonding (HB) will be investigated. Emphasis is placed on the design, materials, process, fabrications, reliability, challenges ...

Fine-pitch wafer-to-wafer hybrid bonding is pivotal for advancing semiconductor integration and requires high overlay accuracy to ensure device performance and ...