Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth ...

Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new ...

AI chip sales to China resume; TSMC accelerates U.S. production; Synopsys-Ansys done deal; Chinese espionage; Nikon's new litho system; SiC, GaN buildout; CPO market; rowhammer attack on GPUs; Q2 ...