The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network (FCN) has ...

Leuders et al. 26, 27 studied post-process treatment effects on fatigue resistance and reported that SLM-produced Ti64 had an extended crack initiation phase, achieved by reducing the porosity, which ...

In practical engineering, the design data are uncertain. The data will deviate from the true value due to technical reasons such as measurement. It would result in the inaccuracy of crack fatigue life ...

Pronounced slip reversibility and tortuous morphology of the crack path may result in a material with higher tolerance to damage than that of conventional aluminum alloys. Factors that improve ...

OpenAI is reportedly considering accusing Microsoft, its largest backer, of anticompetitive behavior throughout their partnership.