CoWoS is indispensable to producing AI processors, such as the GPUs produced by Nvidia and AMD that are used in AI servers or data centers. “You could call it the Nvidia packaging process if you ...

TSMC’s advanced CoWoS and SoIC lines have become the key bottleneck for AI memory bandwidth, giving the company commanding pricing power. The foundry is replicating this 3D packaging and wafer ...

CoWoS revenues will grow at a CAGR (compound annual growth rate) of 19.7% between 2022 and 2025, compared to 10.0% for TSMC total revenues. The Information Network. Chart 2. Investor Takeaway.

Amkor and TSMC on Friday said they had signed a memorandum of understanding to bring TSMC’s proven advanced packaging technologies — chip-on-wafer-on-substrate (CoWoS) and integrated fan-out ...

That 9-reticle 'Super Carrier' CoWoS (offering up to 7,722 mm^2 for chiplets and memory) with 12 HBM4 stacks is planned to be ...

TSMC plans to roll out CoWoS-L with 4,719 mm² interposers and 100×100 mm substrates, supporting up to 12 HBM stacks—likely targeting Nvidia’s Rubin lineup and other heavyweight compute gear.

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition to CoWoS-L packaging.

TSMC is rumored to build new CoWoS advanced packaging plants in the US and Japan due to 'persistently strong demand'. TSMC to double in 2024, again in 2025.

Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators, according to ...

The revised road plan presents the 200 Series, which employs dual-die design produced using CoWoS-L technology. Systems in the 300 Series include single-die (CoWoS-S) and dual-die (CoWoS-L ...

Between 2022 and 2024, TSMC's CoWoS capacity CAGR was actually 100%. TSMC is still on track to double CoWoS capacity to 40K in 2024. Between 2022 and 2024, ...

TSMC's production capacity for CoWoS packaging is forecast to grow at a CAGR of more than 50% from 2023 to 2028, according to DIGITIMES Research. The article requires paid subscription.