Product security and reliability are major concerns in the semiconductor and PCB fabrication industries. Because of this, ...

This article describes a new wafer level capping technology for hermetic or quasi-hermetic 1st level device sealing. The technology is based on fabrication of c ...

In semiconductor fabrication facilities, non-production test wafers constitute a substantial amount of the non-equipment-related consumable expense. With the escalating demand and increased costs ...

(The Center Square) – Wolfspeed, the silicon carbide power solutions company headquartered in North Carolina once in line for three-quarters of $1 billion from the Biden administration, is ...

(The Center Square) – Wolfspeed, the silicon carbide power solutions company headquartered in North Carolina once in line for three-quarters of $1 billion from the Biden administration, is filing for ...

NTT Innovative Devices developed chips by forming UTC-PDs in the device process on SiC wafers with crystal films bonded using CFB technology.

X-FAB's fundamentals remain strong, with Q1 results showing sequential growth in core automotive and industrial segments, and margins holding steady, despite SiC weakness. The company is ...

The Decision Support System from Synopsys is a major step in improving the efficiency of fab engineers by identifying latent behaviors in a wide variety of data sources, correlating these behaviors ...

The University of Michigan has been awarded significant funding to advance heat-tolerant SiC semiconductors from lab to fab.