In this paper, the finite element analysis model of the solder joint of the ball grid array BGA (Ball grid array) is established, and based on the model, the welding point height and the maximum ...

A conformal coating is a protective chemical material that can be applied as a thin layer on printed circuit board assemblies (PCBAs). The purpose of conformal coating is to prevent the interaction ...

Because the memory chips are soldered directly to the mainboard, Triszka had to rely on ball grid array soldering techniques – a process requiring advanced tools and expertise.