News

Tom's Hardware on MSN15h
Intel experimenting with direct liquid cooling for up to 1000W CPUs - package-level approach maximizes performance, reduces size and complexity
Intel is testing a new way to tackle the growing heat output of its power hungry chips. At its recent Foundry Direct Connect ...
Design-Reuse15d
High Density FPGA Package BIST Technique
With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).
MLB17d
Bobby Witt Jr. on being a Play Ball Ambassador
Bobby Witt Jr. talks about being the first-ever Play Ball Ambassador, what the role means to him, his love for the Disney star Goofy and more Globe icon Login icon ...
MLB24d
Vlad Jr. reminds Springer to keep the ball in play
Vladimir Guerrero drops for cover and reminds George Springer to keep the ball in play after a foul ball was hit in his direction ...
Hackaday4y
ball grid array
However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.
Semiconductor Engineering8y
Electroplating IC Packages
Today, flip-chip is still used to make several lower-cost package types, such as ball-grid array (BGA) and chip-scale packages ... Finally, the SnAg material is reflowed or heated into a bump or ...