In this paper, the finite element analysis model of the solder joint of the ball grid array BGA (Ball grid array) is established, and based on the model, the welding point height and the maximum ...

Presence of a thermal enabling load applied to Ball Grid Array (BGA) components creates a distinctive set of evaluations to be completed for reliability of solder joints (SJ) that connect the BGA to ...

The need for more input/output (I/O) connections was a big driver in package evolution. Think about it: a chip with a million ...

If PCBs aren’t tested, errors and defects missed during the manufacturing process could eventually lead to malfunctions and product failures in the field. After a PCB board is manufactured and ...

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