The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the test boards are being assembled in his basement.

However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.

You can see different kinds of soldering in greater detail than ever before, including Ball Grid Arrays on circuit boards, chips, and even leaded soldering. It's a fun watch, even if you've never ...

This could result in solder defects, such as head-in-pillow (HiP), that can ... How to perform a digital image correlation of a ball grid array To better understand DIC, here is an example study ...

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

These characteristics tend to produce more voids in solder balls on ball-grid arrays (BGAs). Since the voids can evade detection by conventional test and automated-optical inspection, x-ray provides ...