2RCOOH+SnO=(RCOO)2Sn+H2O↑ 2HBr+CuO=CuBr2+H2O↑ (b)Flux organic acid ... in the solder joint to form void. Relationship between flux characteristics and void rate Void rate in the solder joint is ...

Melting point: determines the soldering temperature of the solder paste, and the melting point of tin powder of different compositions is different. Particle size: affects the printing performance and ...

“This typically occurs when one solder paste deposit reflows before the other,” said FCT. “It is commonly found on circuit boards that have a ground plane attached to one end of a small component, ...