TSMC’s advanced CoWoS and SoIC lines have become the key bottleneck for AI memory bandwidth, giving the company commanding pricing power. The foundry is replicating this 3D packaging and wafer ...

CoWoS is indispensable to producing AI processors, such as the GPUs produced by Nvidia and AMD that are used in AI servers or data centers. “You could call it the Nvidia packaging process if you ...

That 9-reticle 'Super Carrier' CoWoS (offering up to 7,722 mm^2 for chiplets and memory) with 12 HBM4 stacks is planned to be qualified in 2027, so it is reasonable to expect it to be adopted in ...

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition to CoWoS-L packaging.

Nvidia's (NASDAQ:NVDA) latest Blackwell lineup suggests it will reduce demand for CoWoS-S from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) for at least the next year based on design ...

The Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly increased its orders for machines needed for Chip on Wafer on Substrate (CoWoS) packaging by 30% to keep up with the rising ...

TSMC to begin equipment move-in at its biggest CoWoS advanced packaging and testing plant, AP8 in the Southern Taiwan Science Park (STSP) in April 2025.

The CoWoS technology was first launched in 2016, initially featuring a package size of approximately 1.5x. Today, CoWoS has evolved to 3.3x reticle sizes, capable of accommodating eight HBM3 stacks.