Emerging graphene-based interconnects exhibit excellent conductivity, rendering them a promising alternative to traditional interconnect materials. The energy consumption and delay of ...

Detailed price information for Taiwan Semiconductor ADR (TSM-N) from The Globe and Mail including charting and trades.

Inch Wafer Foundry Market is Segmented by Type (Cutting-Edge (3/5/7nm), 10/14/16/20/28nm, 40/45/65/90nm), by Application ...

This paper investigates the impact of stress, developed during FinFET device fabrication, on electrical characteristics in a 7nm node silicon VLSI technology, focusing on the effects of the active ...

Amongst the highlights: Advanced process capacity (7nm and below) is projected to increase 69% from 2024 to 2028, reaching a record 1.4 million wafers per month in 2028; Capital expenditure on ...

Hardware Processors New chip industry roadmap predicts true 10 nm silicon won't arrive until 2039 and yet Moore's Law is, actually, alive and kicking ...

The term “FinFET” was coined by researchers at the University of California, Berkeley, in the early 2000s. Intel was a pioneer in commercializing FinFET technology, introducing it at their 22nm ...