In a report from Nikkei, the company may also be mulling a return to more cutting-edge semiconductors by working with Intel ...

CDNS and Samsung extend their collaboration to accelerate next-gen chip design with AI-driven IP on advanced nodes.

In the RF domain, Cadence and Samsung have demonstrated an advanced co-design flow for Front-End Module (FEM) and Antenna-in-Package (AiP) designs targeting mmWave applications. Built on Samsung’s ...

RF Chip/Package Co-Design Reference Flow Collaboration Cadence and Samsung Foundry also successfully demonstrated a comprehensive Front-End Module (FEM)/Antenna-in-Package (AiP) co-design flow for ...

Cadence and Samsung collaborated on comprehensive full-flow power integrity analysis for 3D-ICs spanning the entire process, from early exploration to final signoff, and employing advanced Cadence ...

Samsung Electronics is recalibrating its semiconductor foundry roadmap, putting the spotlight squarely on refining its 2 nm ...

14 A is equivalent to 1.4 nm and IMEC expects it will be succeed by 10 A or 1 nm in 2029. IMEC sees that progression carrying ...

Hyung-Ock Kim, vice president and head of the Foundry Design Technology Team at Samsung Electronics, added, "Cadence’s suite of digital tools from RTL to GDS is now certified for Samsung’s latest SF2P ...

UTokyo and Taiwan Semiconductor launched a joint lab for semiconductor research and talent incubation, aiming to advance sustainable technologies.