Data from the Silicon Industry Branch, on 9 July, showed a transaction price range for n-type dense polysilicon between ...

Defect detection requirements on the order of 10 defective parts per million (DPPM) are driving improvements in inspection ...

Researchers at the University of California, Riverside, have uncovered how to manipulate electrical flow through crystalline ...

SK hynix to reportedly change wafer cutting for its next-gen HBM4 memory and 400-layer NAND flash, as they're becoming ...

Innoscience, a leading Chinese GaN specialist, plans to expand its monthly production of 8-inch (200mm) wafers from 13,000 to ...

Chinese entrants like National Silicon Industry Group will limit industry profitability once they scale up 300mm wafer production.

Intel’s answer to these advanced packaging demands is Foveros. They’ve introduced new solutions, Foveros-B and Foveros-R, ...