IoT development kits help accelerate the design of IoT devices as homes, buildings, and cities become more connected.

Samtec’s Si-Fly low-profile cable assemblies provide several mounting options in data center, HPC, and AI applications.

Vishay’s VO1401AEFTR and VOR1003M4T SSRs with high current capability and high isolation voltage can operate in harsh ...

At OFC 2025, imec unveiled a proof of concept for a photonics-based CDM FMCW 144-GHz distributed radar system, which could ...

Hybrid circuit protection devices, using a combination of technologies, provide better protection for industrial Ethernet ...

Omnivision’s OX01N1B low-power 1.5-MP global shutter sensor enables compact camera modules in driver monitoring systems.

Littelfuse’s IXD2012NTR high-side and low-side gate driver drives two N-channel MOSFETs or IGBTs in a half-bridge ...

Vishay’s ISOA200 thick-film power resistors with optional NTC thermistor and phase-change thermal interface material saves ...

At Auto Shanghai, Intel unveils its next-gen AI-enhanced SDV SoC, claiming the automotive industry’s first multi-node chiplet ...

Molex’s new report finds that advanced connector design is needed for constant connectivity in military, avionics, and ...

Renesas Electronics introduces the RA0E2 MCUs with ultra-low power consumption and an extended temperature range.

L-com expands its connector portfolio with rugged Bulgin circular connectors and other interconnects for harsh environments.