TL;DR: NVIDIA’s B300 AI chip production is accelerated to May, utilizing TSMC’s advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs ...

Nvidia will launch a new artificial intelligence chipset for China at a significantly lower price than its recently ...

Nvidia CEO Jensen Huang highlighted key Taiwanese suppliers central to its AI chip packaging and testing ecosystem. These ...

From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March ...

Nvidia is preparing to introduce a more affordable artificial intelligence chip for the Chinese market, which could enter ...

The announcement follows NVIDIA's Computex introduction of NVLink Fusion, a silicon solution enabling hyperscalers to build ...

Alchip has built its reputation as a high-performance ASIC leader through its advanced 2.5D/3D CoWoS packaging, chiplet design, and manufacturing management. Customers include global leaders in ...

According to HCL Group Chairperson Roshni Nadar Malhotra, the project will combine “HCL’s engineering DNA” with “Foxconn’s ...

Nvidia is pushing production of its new B300 AI chip forward to May, using Taiwan Semiconductor Manufacturing’s latest 5nm (N4P) process and CoWoS-L advanced packaging technology. Sources at ...