[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to ...

The Micross co-fired Ceramic Column Grid Array package is the latest addition ... x 20mm package variants (CLGA & CBGA in 142 pad/solder-ball definitions) in RAD-HARD, RAD-Tolerant and Non ...

Offered in ceramic ball grid array (BGA) packages, the CHC-Precision series resistor networks deploy all circuits on the bottom side of the component in order to eliminate wrap-around terminations.

MELVILLE, N.Y., Feb. 23, 2024 /PRNewswire/ -- Micross Components, Inc. ("Micross"), a leading global provider of mission-critical microelectronic components and services for high-reliability ...