Semiconductor Engineering9h
IC Equipment Communication Standards Struggle As Data Volumes Grow
Timely engineering fixes rely on high-speed communications standards, but data inconsistencies are getting in the way.
Semiconductor Packaging News12h
Effect of Package Warpage and Composite CTE on Failure Modes in Board-Level Thermal Cycling
This paper studies board level reliability for surface mount devices during thermal cycling, while specifying failure modes and locations. Failure modes are characterized using thermal warpage and ...
Semiconductor Engineering1d
Wafer-Scale Computing for LLMs (U. of Edinburgh, Microsoft)
A Wafer-Scale LLM Inference System” was published by researchers at University of Edinburgh and Microsoft Research. Abstract ...
ERS electronic GmbH: ERS electronic Unveils Production, R&D Facility, and Competence Center for Advanced Packaging in Germany
Today, ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, celebrated the official opening of ...
ERS electronic Unveils Production, R&D Facility, and Competence Center for Advanced Packaging in Germany
ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, celebrated the official ...