Microtronic, maker of advanced macro defect inspection systems and software, has announced a convenient and highly precise ...

--ACM Research, Inc., a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced the launch of ACM’ s Ultra ECP GIII ...

This allows for better uniformity within wafer and within die during high-speed plating. Wafers processed using this technology achieve wafer-level uniformity below 3%, an improvement over other ...

This is the world’s first cup-type plating laboratory equipment for manufacturing semiconductor wafers, using 10 liters or less of plating solution and handling 8-inch wafers. Many development ...

HSINCHU, Taiwan, Sept. 20, 2018 /PRNewswire/ -- Amid over demand from power management components (MOSFET) in booming smart car markets, and addre ...

In addition, Mycropore received repeat purchase orders for the PanalfeGard™ series filter which has been qualified in back-end bump plating application on the Ebara ® Technology wafer bump ...

FREMONT, Calif., Aug. 07, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...

These include <100nm alignment accuracy, new levels of cleanliness in chip-to-wafer bonding and singulation tools, exceptional CMP planarity with 0.5nm RMS roughness, and plating for optimal bonding. ...

Automated system for flat or notched wafers; multiple orders to ship during third quarter of 2021FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a ...