Hybrid bonding is being evaluated for advanced packaging of 2.5 and 3D modules due to the enhanced scalability and performance (thermal, electrical and reliability) of the interconnect. The direct ...

Single crystal wafers, such as silicon, are the fundamental carriers of advanced electronic devices. However, these wafers exhibit rigidity without mechanical flexibility, limiting their applications ...

Wafer map defect pattern recognition provides useful clues to yield learning. However, most wafer maps have no special spatial patterns and are full of noises, which make pattern recognition difficult ...

The interest in the wafer-scale growth of two-dimensional (2D) materials, including transition metal dichalcogenides (TMDCs), has been rising for transitioning from lab-scale devices to ...

The VOLT™ Distal Radius and Proximal Humerus 3.5 Plating System, are now commercially available in the U.S., with additional anatomic plating solutions expected to join the platform throughout the ...

Johnson & Johnson $152.743 0.29% Open 150.939 Day High 153.043 52 Week High 170.27 52 Week Low 141.57 announced today that it launched new variable angle optimized locking technology (VOLT ...

Solstice to perform volume gold electroplating of inkjet printheads used in commercial and industrial applicationsKALISPELL, Mont., June 17, 2025 (GLOBE NEWSWIRE) -- ClassOne Technology, a leading ...