Amazon makes stocking my toolbox easy when I need new DIY essentials. It saves me time, money, and stress, and with next-day ...

High performance 3D integration Systems need a higher interconnect density between the die than traditional μbump interconnects can offer. For ultra-fine pitches interconnect pitches below 5μm a ...

A novel jigsaw puzzle method was developed to fabricate the high-performance CuPc and F 16 CuPc organic single-crystal field-effect transistors and circuits on ultra-fine and flexible Au wires with ...