Two-dimensional (2D) materials are among the most promising candidates for beyond-silicon electronic, optoelectronic, and quantum computing applications. Recently, their recognized importance sparked ...

Since the first Fan-out Wafer Level Packaging (FOWLP) was introduced in 2001 by Infineon, lots of technical advancements and studies related to this technology have been reported, but thermal studies ...

Product security and reliability are major concerns in the semiconductor and PCB fabrication industries. Because of this, ...

Challenging Thermal Symmetry Kirchhoff's law of thermal radiation (1860) states that at thermal equilibrium, a material's emissivity equals its absorptivity at each wavelength and angle. Practically, ...

In a groundbreaking development, NASA has announced a new alloy that could be the key to unlocking ultra-stable space telescopes needed to detect exoplanets and their potential for habitability. This ...

A new material called Alloy 30 shrinks when it is heated and expands when it is cooled and it could help with telescope thermal stability.

This study experimentally and computationally investigates the convection heat transfer performance of metal foams (MFs) having the same pores per inch (PPI) but different porosities attached to a ...