Apple to reportedly use TSMC's advanced WMCM and SoIC packaging for next-gen A20 and server chips, monthly wafer production ...

TSMC's major chip customers are expected to upgrade to its next-gen 2nm process node in 2026, with Apple and Bitmain to be ...

TSMC's advanced packaging tech and global expansion drive AI innovation and stock growth, despite geopolitical and capital ...

Developed by TSMC and unveiled in 2018, SoIC (System on Integrated Chip) technology allows for the stacking of chips in a three-dimensional structure, providing better electrical performance and ...

The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked system-on ...

Finally, TSMC's N2 technology features a new Cu RDL option with flat passivation and TSVs that is optimized for face-to-face ...

TSMC’s strength in manufacturing was reinforced by rapid scaling in CoWoS and SoIC capacity, both growing at over 80% CAGR through 2026, while its silicon photonics strategy promises major ...

TSMC's CoWoS-S is used for AMD's Instinct MI250 as well as Nvidia's A100 and H100/H200 processors, ... AP7 is also set to support TSMC's SoIC (System on Integrated Chips) packaging methods, ...

Apple has ordered M5 chips from TSMC as the company begins production development of its next-generation processor for future devices, reports Korean-language outlet The Elec citing Taiwanese ...

Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly working with Nvidia to develop next-generation GPUs utilizing advanced chiplet technology. This collaboration is expected to play an ...