Comprehensive Multi-Die System Design Solution Supports 3Dblox 2.0 Standard and TSMC 3DFabric TM Technologies to Boost Productivity for Fast Heterogeneous Integration Highlights: Synopsys 3DIC ...

Synopsys revealed it is closely aligning its AI-powered EDA suite and multi-die solutions with TSMC's latest process nodes and 3D packaging tech. The goal is to pave the way for designs packing ...

Taiwan computer chip maker TSMC has reported its profit in the last quarter rose 57%, ... (TSMC) logo brands the headquarters in Hsinchu, Taiwan, Wednesday, Oct. 20, 2021. Credit: AP/Chiang Ying-ying.

FILE PHOTO: A logo of chip giant TSMC can be seen in Tainan, Taiwan December 29, ... a Canadian tech research firm, took apart a Huawei 910B AI accelerator and found a TSMC die, ...

They objected, and TSMC has now agreed to look elsewhere, reports Reuters. ... New iPhone 17 Pro renders highlight aluminum design, repositioned Apple logo. Michael Burkhardt Jul 6 2025.

Apple chipmaker TSMC says that it will make chips with a sub-2nm process size for the first time ever in 2028, and that the development of 1.4nm chips will allow for greater AI capabilities.. The ...

Figure 1 CoWoS-L marks a significant advancement over CoWoS-S in terms of performance and efficiency for AI and HPC applications. Source: TSMC Huang also told Taiwanese reporters that Nvidia is still ...

--Synopsys, Inc. today announced it is extending its collaboration with TSMC to advance multi-die system designs with a comprehensive solution supporting the latest 3 Dblox 2.0 standard and TSMC's ...